| DATE: | 1/21/2009 | RECIPE: | LSNIT | Operator | Gordon | ||||
| Tool ID: | PD01 | ||||||||
| Process: | Low Stress PECVD Silicon Nitride | ||||||||
| TEMP: | 250 C | DEP TIME | 10 | min | PRCPR | 900 mTorr | Power | 100 W | |
| GAS | 2% SiH4 | GAS | NH3 | GAS | N2 | GAS | He | ||
| FLOW | 200 | FLOW | 4 | FLOW | 200 | FLOW | 600 | ||
| WAFER: | 4" SILICON | ||||||||
| SIZE | 100mm | Substrate: | 100 | ||||||
| LOAD | 1 | Comment: | Ellip. T=111 nm n0 = 1.804 n1 = 101.9 n2 = 17.1 | ||||||
| Nanospec | |||||||||
| POSITION | Center | Top | Left | Flat | Right | Mean Avg | S1 Dev | + or - % | HI-LO% |
| center | 1040 | 1052 | 1022 | 1036 | 1044 | 1038.8 | 11.10 | 1.07 | 1.44 |
| Dep Rate: | 103.88 | A/min | |||||||