| DATE: | 6/17/2008 | RECIPE: | LSNIT | Operator | Gordon | ||||
| Tool ID: | PD01 | ||||||||
| Process: | Low Stress PECVD Silicon Nitride | ||||||||
| TEMP: | 250 C | DEP TIME | 10 | min | PRCPR | 900 mTorr | Power | 100 W | |
| GAS | 2% SiH4 | GAS | NH3 | GAS | N2 | GAS | He | ||
| FLOW | 200 | FLOW | 4 | FLOW | 200 | FLOW | 600 | ||
| WAFER: | 4" SILICON | ||||||||
| SIZE | 100mm | Substrate: | 100 | ||||||
| LOAD | 1 | Comment: | Ellip. T=120.27 nm n0 = 1.796 n1 = 125.1 n2 = -11.7 | ||||||
| Nanospec | |||||||||
| POSITION | Center | Top | Left | Flat | Right | Mean Avg | S1 Dev | + or - % | HI-LO% |
| center | 1123 | 1110 | 1118 | 1131 | 1125 | 1121.4 | 7.89 | 0.70 | 0.94 |
| Dep Rate: | 112.14 | A/min | |||||||