| DATE: | 3/4/2008 | RECIPE: | LSNIT | Operator | Gordon | ||||
| Tool ID: | PD01 | ||||||||
| Process: | Low Stress PECVD Silicon Nitride | ||||||||
| TEMP: | 250 C | DEP TIME | 10 | min | PRCPR | 900 mTorr | Power | 100 W | |
| GAS | 2% SiH4 | GAS | NH3 | GAS | N2 | GAS | He | ||
| FLOW | 200 | FLOW | 4 | FLOW | 200 | FLOW | 600 | ||
| WAFER: | 4" SILICON | ||||||||
| SIZE | 100mm | Substrate: | 100 | ||||||
| LOAD | 1 | Comment: | Ellip. T=118.6 nm n0 = 1.805 n1 = 120.4 n2 = 1.1 | ||||||
| Nanospec | |||||||||
| POSITION | Center | Top | Left | Flat | Right | Mean Avg | S1 Dev | + or - % | HI-LO% |
| center | 1064 | 1038 | 1026 | 1056 | 1058 | 1048.4 | 15.84 | 1.51 | 1.81 |
| Dep Rate: | 104.84 | A/min | |||||||