| DATE: | 12/12/2008 | Operator | Keith Bradshaw | ||||||
| Process: | Cryo Evap: Aluminum | ||||||||
| Target | 3000A | ||||||||
| TEMPC: | 25 | ||||||||
| WAFER: | 4" SILICON | ||||||||
| SIZE | 100mm | Substrate: | 100 | ||||||
| LOAD | 1 | Comment | Sheet resistance = 121 mOhm/sq +-3.41% | ||||||
| Run | CENTER | TOP | LEFT | FLAT | RIGHT | Mean Avg | S1 Dev | + or - % | HI-LO% |
| 1 | 3720 | 3131 | 3581 | 3579 | 3417 | 3485.6 | 225.40 | 6.47 | 8.45 |
| Sheet R | 0.121 | + / - % | 0.48 | Ohm/sq | |||||
| Resistivity | 4.22E-06 | Ohm-cm | |||||||
| Bulk Al | 2.82E-06 | Ohm-cm | |||||||