| DATE: | 12/12/2008 | Operator | Keith Bradshaw | ||||||
| Process: | CHA-50 Evap: Aluminum | ||||||||
| Target: | 3000A | ||||||||
| TEMPC: | 25 | ||||||||
| WAFER: | 4" SILICON | ||||||||
| SIZE | 100mm | Substrate: | 100 | ||||||
| LOAD | 1 | Comment | Sheet resistance = 237.7 mOhm/sq +-0.753% | ||||||
| Run | CENTER | TOP | LEFT | FLAT | RIGHT | Mean | S1 Dev | + or - % | HI-LO% |
| 1 | 2821 | 2756 | 2863 | 2780 | 2789 | 2801.8 | 41.38 | 1.48 | 1.91 |
| Sheet R | 0.2377 | + / - % | 0.753 | Ohm/sq | |||||
| Resistivity | 6.66E-06 | Ohm-cm | |||||||
| Bulk Al | 2.82E-06 | Ohm-cm | |||||||