DATE:	8/21/2009		RECIPE:	Aluminum		Operator	Arnold
Gun #:	2		FILE:	AlGun2_200W60min
Process:	Aluminum Deposition, RF		DC
PowerW	200	DEP TIME	60	min
TEMPC:	25	GAS	Ar
Pressure	4mTorr	FLOW	20
WAFER:	4" SILICON
SIZE	100mm	Substrate:	<100>
LOAD	1	Comment:
Run	CENTER	TOP	LEFT	FLAT	RIGHT	Mean Avg	S1 Dev	+ or - %	HI-LO%
1	3441	4816	4501	4835	3174	4153.4	789.17	19.00	20.00
						Dep Rate:	69.22	A/min
						Sheet R	0.0694	Ohm/sq	+ / - %	0.224
						Resistivity	2.88E-06	Ohm-cm
						Bulk Al	2.82E-06	Ohm-cm