| DATE: | 6/24/2009 | RECIPE: | Aluminum | Operator | Arnold | |||||
| Gun #: | 2 | FILE: | AlGun2_200W60min | |||||||
| Process: | Aluminum Deposition, | DC | ||||||||
| PowerW | 200 | DEP TIME | 60 | min | ||||||
| TEMPC: | 25 | GAS | Ar | |||||||
| Pressure | 4mTorr | FLOW | 20 | |||||||
| WAFER: | 4" SILICON | |||||||||
| SIZE | 100mm | Substrate: | <100> | |||||||
| LOAD | 1 | Comment | ||||||||
| Run | CENTER | TOP | LEFT | FLAT | RIGHT | Mean Avg | S1 Dev | + or - % | HI-LO% | |
| 1 | 3835 | 4073 | 3783 | 3582 | 3729 | 3800.4 | 179.31 | 4.72 | 6.46 | |
| Dep Rate: | 63.34 | A/min | ||||||||
| Sheet R | 0.0802 | Ohm/sq | + / - % | 1 | ||||||
| Resistivity | 3.05E-06 | Ohm-cm | ||||||||
| Bulk Al | 2.82E-06 | Ohm-cm | ||||||||