DATE:	1/29/2009		RECIPE:	Aluminum		Operator	Arnold
Gun #:	2		FILE:	AlGun2_200W60min
Process:	Aluminum Deposition, RF		DC
PowerW	200	DEP TIME	60	min
TEMPC:	25	GAS	Ar
Pressure	4mTorr	FLOW	20
WAFER:	4" SILICON
SIZE	100mm	Substrate:	100
LOAD	1	Comment:	New Targer Installed
Run	CENTER	TOP	LEFT	FLAT	RIGHT	Mean Avg	S1 Dev	+ or - %	HI-LO%
1	4033	3984	3691	3687	3981	3875.2	171.23	4.42	4.46
						Dep Rate:	64.59	A/min
						Sheet R	0.0998	Ohm/sq	+ / - %	0.54
						Resistivity	3.87E-06	Ohm-cm
						Bulk Al	2.82E-06	Ohm-cm