The
2006 IFIP International Conference on
Embedded
and Ubiquitous Computing (EUC'2006)
Conference major web page: http://euc.wonkwang.ac.kr/
On-line paper submission site: http://zen.utdallas.edu/euc06
The most recent call-for-papers can be found here: CFPEUC06.txt
PROGRAM CHAIR
Edwin Sha,
edsha@utdallas.edu
PROGRAM VICE-CHAIRS
Real-time
and Operating Systems
Tei-Wei Kuo,
Power Aware
Computing
Jihong Kim,
Embedded
System Software & Optimization
Jenq-Kuen Lee,
Embedded
System Architectures
Jun Yang,
Embedded and
Reconfigurable Hardware
Morris Chang,
HW/SW
Co-design and Design Automations
Ting-Chi Wang,
Mobile
Computing
Jiannong Cao,
Agent and
Distributed Computing
Franco Zambonelli, University of
Modena and Reggio Emilia, Italy
Middleware
& P2P
Cho-Li Wang, The
Wireless
Communication
Chu-Sing Yang,
Network
Protocol
Jie Li,
Multimedia,
Human-Computer Interface and Data Management.
Li Jianzhong, Harbin Institute of
Security
& Fault Tolerance
Yoohwan Kim,
PROGRAM COMMITTEE
Sang Young Cho,
Lynn Choi,
Dong-Won Han, ETRI,
Taisook Han, KAIST,
Youn-Hee Han,
Dongwon Jeong,
Soon Ju Kang,
Doohyun Kim,
Jung Guk Kim,
Sun-Ja Kim, ETRI,
Dong Chun Lee,
Chae-Deok Lim, ETRI,
Pyung-Soo Ma, ETRI,
Byoung-Joon Min,
Sanjoy Baruah,
Pete Beckman, Argonne
National Lab., USA
Claudio E. Casetti,
Politecnico di Torino, Italy
Chaitali Chakrabarti,
Arizona State Univ., USA
Naehyuck Chang, Seoul National Univ.,
Rong-Guey Chang, National
Chantana Chantrapornchai,
Pascal Chatonnay,
Universite De Franche-Comte, France
Sao-Jie Chen, National
Yih-Farn Chen, AT&T Research Labs,
Ray-Guang Cheng,
Slo-Li
Hao-Hua
Sung Woo Chung,
Yeh-Ching Chung, National
Siobh嫕
Clarke,
Gerard Damm, Alcatel
Mark d'Inverno, University of Westminster, UK
Lan-Rong Dung, National Chiao Tung Univ.,
Stephen A. Edwards,
Javier Garcia-Villalba,
Dan Feng,
Xiang (Alex) Feng, Microsoft Corporation,
Hong Gao, Harbin Institute of
Marie-Pierre Gleizes,
IRIT- Universita' Paul Sebatier Toulouse, France
Hani A K Hagras,
David Hales,
Universita' di Bologna, Italy
Salima Hassas,
Universite' de Lyon, France
Bo Hong, Drexel Univ.,
USA
Jiman Hong, Kwangwoon
Univ., Korea
Pao-Ann Hsiung,
Ching-Hsien Hsu, Chung Hua Univ.,
Feng-Hsiung Hsu,
Microsoft Research Asia, China
Hui-Huang Hsu,
Fei Hu, Rochester Institute of
Weichih Hu,
Michael C. Huang,
Shih-Hsu Huang,
Wei Huang, Iowa State
Univ., USA
Yo-Ping Huang,
Ren-Hung Hwang, National Chung Cheng Univ.,
Wen-Jyi Hwang, National Taiwan Normal Univ.,
Yin-Tsung Hwang, National Chung Hsing Univ.,
Tohru Ishihara,
Rong-Hong Jan, National Chiao Tung Univ.,
Ravindra Jejurikar, Sun Microsystems,
Ju-Yeon Jo, California
State University, Sacramento, USA
David B. Johnson, Rice
Univ., USA
Roy Ju, Google Inc.,
USA
Shiguang Ju, Jiangsu
University, China
Mahmut Kandemir,
Pennsylvania State Univ., USA
Jae-Hyun Kim, Ajou
Univ., Korea
Hsien-Hsin (Sean) Lee, Georgia Institute of
Jaejin Lee, Seoul National Univ.,
Woo Hyong Lee, Samsung Co.,
Minglu Li, Shanghai
Jiantong Univ., China
Qing Li, City
Xiang-Yang Li, IIT, USA
Xiaoming Li,
Xuandong Li,
Yingshu Li, Georgia
State Univ., USA
Wanjiun Liao, National
Taiwan Univ., Taiwan
Vincenzo Liberatore,
Case Western Reserve Univ., USA
Yao-Nan Lien, National
Chengchi Univ., Taiwan
Ee-Peng Lim, Nanyang Technological
Sung-Soo Lim,
Frank Yeong-Sung Lin, National Taiwan Univ.,
Phone Lin, National Taiwan Univ.,
Xuemin Lin,
Tok Wang Ling, National
Chia-Tien Dan Lo,
Shi-Wu Lo, National Chung Cheng Univ.,
Yung-Hsiang Lu,
Mon-Yen Luo, Cheng
Rabi N. Mahapatra, Texas
A&M Univ., USA
Marco Mamei, Universita'
di Modena e Reggio Emilia, Italy
Gokhan Memik, Northwestern
Sang Lyul Min,
Pablo Noriega,
IIIA-CSIC, Spain
Andrea Omicini,
Universita' di Bologna, Italy
Timothy O'Neil,
Nelson Passos, Midwestern
Massimo Poncino,
Politecnico di Torino, Italy
Yi Qian,
Vijay Raghunathan, NEC Labs
Michael Rovatsos,
Pedro M. Ruiz,
Zili Shao, The Hong Kong Polytechnic Univ., Hong
Kong
Onn Shehory, IBM Haifa Research Labs,
Shashi Shekhar,
Timothy Sherwood,
Yuanchun Shi,
Ce-Kuen Shieh, National Cheng Kung Unive.,
Wei-Kuan Shih, National
Dongkun Shin,
Bala Srinivasan,
Witawas Srisa-an,
Jaideep Srivastava,
Univ. of Minisota, USA
Ching-Lung Su, National Yunlin Univ. of Science and
Hyo-Joong Suh, The Catholic
Min-Te Sun, Auburn
Univ., USA
Yuqing Sun,
David Surma,
Robert Tolksdorf, Free
Hiroyuki Tomiyama,
Sissades Tongsima, NSTDA,
Chien-Chao Tseng,
Putchong Uthayopas,
Ramakrishna
Vishnuvajjala, Lucent Technologies, USA
Chun-Yao Wang, National Tsing
Guojung Wang, Central
Jinling Wang, NEC
Li-C. Wang, Univ. of
California, Santa Barbara, USA
Li-Chun Wang,
Ling Wang, Harbin Institute of
Yan Wang,
Zhijun Wang, Hong Kong Polytechnic Univ., Hong
Kong
Hongxing Wei,
Gang Wu, Shanghai Jiaotong Univ.,
Jun
Kui Wu,
Bin Xiao, Hong Kong Polytechnic Univ., Hong Kong
Yuan
Jianliang Xu, Hong Kong Baptist Univ., Hong Kong
Ming Xu, National
Jason Xue,
Dong Xuan, Ohio State
Univ., USA
Haijin Yan, Motorola,
USA
Mei Yang,
Yang Yang,
Xu Jeffrey Yu, Chinese
Qin-an Zeng,
Youtao Zhang,
Huiyang Zhou,
Da Yong Zhou,
Xiaofang Zhou,
Xingshe Zhou, Northwestern Polytechnical
Zhichun Zhu,